Compact power, critical performance

BATTLEFIELD TECHNOLOGIES increasingly rely on distributed electronics: tactical radios, navigation tools, body-worn sensors, environmental monitors and night-vision systems all requiring stable, high-speed links to function. These devices need connectors small enough to fit into scaled-down housings yet robust enough to maintain signal integrity under vibration, temperature cycling and environmental exposure.

The power architecture is changing too. Portable and wearable devices draw energy from decentralised sources, meaning connectors must simultaneously support power distribution, rapid charging and data transfer within a single, space-efficient footprint.

To meet these demands, modern SFF connectors use high-density contact arrays, hybrid layouts for combined signal and power, and metal or composite materials chosen for strength, low weight and thermal stability. They are built to deliver more capability in less space, without compromising ruggedness.

Strength at micro scale

Miniaturisation brings a specific set of engineering constraints. As contact density increases and enclosure size decreases, both electrical and mechanical stresses become more difficult to manage. Higher current concentration can lead to thermal buildup, making heat dissipation a critical consideration in compact connector designs.

Signal behaviour also changes at smaller geometries. Reduced spacing heightens the risk of crosstalk and attenuation, requiring precisely controlled impedance, carefully designed shielding, and robust grounding to preserve high-speed performance.

Material selection is equally important. High-strength polymers, metal alloys and composite structures are chosen for their stability, environmental resistance and low mass. At this scale, manufacturing tolerances must be extremely tight; minor deviations can affect sealing, retention force or overall alignment.

Mechanical interfaces face similar pressures. Low-profile coupling systems must deliver reliable engagement over many mating cycles while resisting vibration, debris and field handling. Ensuring consistent performance under these constraints is what defines the next generation of small-form-factor connectors.

Platform-level integration

Modern defence platforms demand interconnect solutions that adapt to a wide range of mechanical, spatial and operational constraints. As electronic architectures become more distributed and compact SFF connectors have expanded to support multiple mounting approaches, from board-to-board and cable-to-panel terminations to inline and ultra-low-profile formats. This versatility allows engineers to position high-density interfaces in confined or irregular spaces while maintaining reliable performance under vibration, impact and environmental exposure.

Wearable and handheld systems place additional emphasis on ergonomics and safety. Here, low-profile SFF designs reduce snagging and bulk, while floating mounts and plug-in assemblies help maintain continuity where movement or partial misalignment is inevitable. For applications requiring absolute connection certainty, many SFF solutions incorporate tactile or audible feedback to confirm secure mating, supporting operability in low-light or high-stress environments.

These advances do not eliminate the role of established Mil-Spec standards. Connectors such as MIL-DTL-38999 remain indispensable for systems that require high load capacity, proven sealing performance or compatibility with long-standing platform infrastructure. 

As a result, contemporary defence designs increasingly employ a hybrid interconnect strategy: compact SFF connectors for space-restricted or weight-sensitive subsystems, such as UAV payloads, soldier-worn electronics and compact ISR modules, combined with traditional Mil-Spec interfaces for larger assemblies and mission-critical backbone functions. This integrated approach preserves reliability and interoperability while enabling incremental modernisation across diverse platforms.

Manufacturers are already pushing boundaries. ITT Cannon’s HDx series, distributed by PEI-Genesis, delivers high-density circular connectivity capable of supporting HDMI, USB and Ethernet in a footprint dramatically smaller than traditional MIL-DTL-38999. With operating temperatures from −51 to +125°C and up to 5000 mating cycles, it exemplifies how modern SFF design blends miniaturisation with uncompromising ruggedness.

Andy Milner is product manager at PEI-Genesis

www.peigenesis.com