Thermally conductive pads enhance electrical insulation

To improve electrical insulation between high-power components, the CHO-THERM HV Series incorporates robust dielectric layers. Alongside impressive thermal performance, these properties are designed to meet the stringent engineering demands of modern automotive and industrial systems. The materials exhibit dielectric constant as low as -0.05 at 1 MHz (ASTM D150 test method) and dissipation factor down to 2.8 at 1 MHz (Chomerics CHO-TM-TP13).

“CHO-THERM HV marks an important addition to our technology portfolio, meeting the thermal management needs of systems where enhanced electrical insulation is paramount,” says Keith McDonald, International Director of Sales, Parker Chomerics. “The materials offer superior performance across a broad spread of applications that include automotive electronics and on-vehicle power systems, lighting assemblies, high-voltage sensors and actuators, and electric vehicle charging stations.” 

CHO-THERM HV is also suited to alternative energy power conversion/inversion systems, heavy-duty industrial equipment and industrial motor controllers. Parker Chomerics engineered the materials to provide effective thermal transfer from heat-generating components such as CPUs, GPUs and high-power busbars to heat-dissipating components like cold plates, heatsinks, cooling pipes and vapour chambers. 

Additional benefits extend to minimal outgassing, V-0 flammability compliance under the globally recognised UL94 standard and ultra-low compression force characteristics that simplify installation. With Shore 00 hardness ratings of 30–35, CHO-THERM® HV solutions conform readily to uneven or textured mating surfaces, eliminating air gaps and improving thermal contact. 

Customers can now specify the pads in standard sheet formats for high-volume processing or select custom die-cut configurations tailored to complex geometries. Four RoHS-compliant material variants are available, with specialists from Parker Chomerics ready to assist with the optimal selection. PSA (pressure-sensitive adhesive) bonding options are available where added adhesion strength is necessary.

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